1. Development of numerical algorithm to guide solder joint structure and component structural design during manufacturing. (April 2017) Authors: Chen, Yilong; Jia, Jianyuan; Fu, Hongzhi; Zhu, Zhaofei Journal: Microelectronics and reliability Issue: Volume 71(2017) Page Start: 134 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Analysis of the BGA solder Sn–3.0Ag–0.5Cu crack interface and a prediction of the fatigue life under tensile stress. (June 2016) Authors: Chen, Yilong; Jia, Jianyuan; Fu, Hongzhi; Zeng, Zhi Journal: International journal of fatigue Issue: Volume 87(2016) Page Start: 216 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Investigation of elastic properties, anisotropy and edge dislocations of Ti3Al with tensor theory and bond matrix model. (August 2022) Authors: Fu, Hongzhi Journal: Intermetallics Issue: Volume 147(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Analysis of the BGA solder Sn–3.0Ag–0.5Cu crack interface and a prediction of the fatigue life under tensile stress. (June 2016) Authors: Chen, Yilong; Jia, Jianyuan; Fu, Hongzhi; Zeng, Zhi Journal: International journal of fatigue Issue: Volume 87(2016) Page Start: 216 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Luminescent properties of Eu-doped magnetic Na3FeF6. Issue 67 (14th November 2018) Authors: Jia, Hong; Zhou, Yiping; Wang, Xiaoyan; Zhang, Weiying; Feng, Xun; Li, Zhiang; Fu, Hongzhi; Zhao, Jianguo; Liu, Zhongli; Liu, Xiaofeng Journal: RSC advances Issue: Volume 8:Issue 67(2018) Page Start: 38410 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Synthesis and phase transformation of NaGdF4:Yb–Er thin films using electro-deposition method at moderate temperatures. Issue 43 (15th October 2018) Authors: Jia, Hong; Zhou, Yiping; Li, Xue; Li, Yan; Zhang, Weiying; Fu, Hongzhi; Zhao, Jianguo; Pan, Liuzhan; Liu, Xiaofeng; Qiu, Jianrong Journal: CrystEngComm Issue: Volume 20:Issue 43(2018) Page Start: 6919 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement. Issue 3 (27th May 2014) Authors: Xia, Weisheng; Xiao, Ming; Chen, Yihao; Wu, Fengshun; Liu, Zhe; Fu, Hongzhi Journal: Soldering & surface mount technology Issue: Volume 26:Issue 3(2014) Page Start: 162 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement. Issue 3 (27th May 2014) Authors: Xia, Weisheng; Xiao, Ming; Chen, Yihao; Wu, Fengshun; Liu, Zhe; Fu, Hongzhi Journal: Soldering & surface mount technology Issue: Volume 26:Issue 3(2014) Page Start: 162 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗