1. Characterization of nano-enhanced interconnect materials for fine pitch assembly. Issue 1 (28th January 2014) Authors: Zhang, Yan; Sitek, Janusz; Fan, Jing-yu; Ma, Shiwei; Koscielski, Marek; Ye, Lilei; Liu, Johan Editors: Agata Skwarek, Dr Journal: Soldering & surface mount technology Issue: Volume 26:Issue 1(2014) Page Start: 12 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗