1. High‐Tg Thiol‐Click Thermoset Networks via the Thiol‐Maleimide Michael Addition. Issue 13 (11th May 2016) Authors: Parker, Shelbi; Reit, Radu; Abitz, Haley; Ellson, Gregory; Yang, Kejia; Lund, Benjamin; Voit, Walter E. Journal: Macromolecular rapid communications Issue: Volume 37:Issue 13(2016) Page Start: 1027 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Hybrid cured thiol-ene/epoxy networks for core-shell semiconductor packaging. Issue 1 (2016) Authors: Maaraoui, Kayla V.; Ellson, Gregory; Voit, Walter Journal: MRS advances Issue: Volume 1:Issue 1(2016) Page Start: 57 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Tough thiourethane thermoplastics for fused filament fabrication. Issue 6 (13th October 2017) Authors: Ellson, Gregory; Carrier, Xavier; Walton, Jamie; Mahmood, Samsuddin Faisal; Yang, Kejia; Salazar, Joshua; Voit, Walter E. Journal: Journal of applied polymer science Issue: Volume 135:Issue 6(2018) Page Start: n/a Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Tunable thiol–epoxy shape memory polymer foams. (31st March 2015) Authors: Ellson, Gregory; Prima, Matthew Di; Ware, Taylor; Tang, Xiling; Voit, Walter Journal: Smart materials and structures Issue: Volume 24:Number 5(2015:May) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗