1. Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking. (December 2020) Authors: Arnaud, L.; Karam, C.; Bresson, N.; Dubarry, C.; Borel, S.; Assous, M.; Mauguen, G.; Fournel, F.; Gottardi, M.; Mourier, T.; Cheramy, S.; Servant, F. Journal: MRS communications Issue: Volume 10:Number 4(2020) Page Start: 549 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗