Author/Creator: Degrenne, N. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Degrenne, N.

1. Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling. (November 2020)

Authors:: Dornic, N.; Ibrahim, A.; Khatir, Z.; Degrenne, N.; Mollov, S.; Ingrosso, D.
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
Page Start:
Record Type:: Journal Article
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2. Lifetime extension through Tj equalisation by use of intelligent gate driver with multi-chip power module. (September 2018)

Authors:: Brandelero, J.; Ewanchuk, J.; Degrenne, N.; Mollov, S.
Journal:: Microelectronics and reliability
Issue:: Volume 88/90(2018)
Page Start:: 428
Record Type:: Journal Article
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3. Using of bond-wire resistance as aging indicator of semiconductor power modules. (November 2020)

Authors:: Ibrahim, A.; Khatir, Z.; Ousten, J.P.; Lallemand, R.; Degrenne, N.; Mollov, S.; Ingrosso, D.
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
Page Start:
Record Type:: Journal Article
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4. Wire-bond contact degradation modeling for remaining useful lifetime prognosis of IGBT power modules. (November 2020)

Authors:: Nazar, M.; Ibrahim, A.; Khatir, Z.; Degrenne, N.; Al-Masry, Z.
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗