1. Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol. (June 2020) Authors: Bhogaraju, Sri Krishna; Mokhtari, Omid; Conti, Fosca; Elger, Gordon Journal: Scripta materialia Issue: Number 182(2020) Page Start: 74 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Numeric Simulation‐Based Analysis of the Mixing Process in Anaerobic Digesters of Biogas Plants. Issue 8 (3rd June 2020) Authors: Conti, Fosca; Saidi, Abdessamad; Goldbrunner, Markus Other Names: Thrän Daniela guestEditor.; Pfeiffer Diana guestEditor. Journal: Chemical engineering & technology Issue: Volume 43:Issue 8(2020) Page Start: 1522 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Thermomechanical stress in GaN‐LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy. (27th July 2020) Authors: Liu, E.; Conti, Fosca; Bhogaraju, Sri Krishna; Signorini, Raffaella; Pedron, Danilo; Wunderle, Bernhard; Elger, Gordon Other Names: Grisch Frédéric guestEditor.; Barviau Benoit guestEditor.; Attal‐Trétout Brigitte guestEditor.; Kiefer Johannes guestEditor. Journal: Journal of Raman spectroscopy Issue: Volume 51:Number 10(2020) Page Start: 2083 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗