1. Analysis on Ultrasonic TOFD Imaging Testing for Ultra-thick-walled EBW Joint of Aluminum Alloy. (2017) Authors: Cong, S.; Zhang, W.W.; Zhang, J.Y.; Gang, T. Journal: Procedia engineering Issue: Volume 207(2017) Page Start: 1910 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Anisotropic large magnetoresistance and Fermi surface topology of terbium monoantimonide. (May 2022) Authors: Tang, F.; Shen, X.; Zhou, J.; Cong, S.; Zhang, L.; Zhou, W.; Han, Z.-D.; Qian, B.; Jiang, X.-F.; Zheng, R.-K.; Zhao, W.; Kan, X.-C.; Tang, J.; Han, Y.-Y.; Yin, X.-Q.; Fang, Y.; Ju, S. Journal: Materials today physics Issue: Volume 24(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Failure analysis of SUS304 sheet during hydro-bulging based on GTN ductile damage model. Issue 1 (September 2016) Authors: Zhang, W.; Cong, S. Journal: International journal of advanced manufacturing technology Issue: Volume 86:Issue 1/4(2016) Page Start: 427 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Failure analysis of SUS304 sheet during hydro-bulging based on GTN ductile damage model. Issue 1 (September 2016) Authors: Zhang, W.; Cong, S. Journal: International journal of advanced manufacturing technology Issue: Volume 86:Issue 1/4(2016) Page Start: 427 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. On exponential stability conditions of linear neutral stochastic differential systems with time‐varying delay. (2nd April 2012) Authors: Cong, S. Journal: International journal of robust and nonlinear control Issue: Volume 23:Number 11(2013) Page Start: 1265 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading. (March 2022) Authors: Cong, S.; Zhang, W.W.; Liu, P.; Han, Y.N.; Tian, Y.H. Journal: Microelectronics journal Issue: Volume 121(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗