1. Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment. (May 2022) Authors: Straubinger, Dániel; Illés, Balázs; Busek, David; Codreanu, Norocel; Géczy, Attila Journal: Case studies in thermal engineering Issue: Volume 33(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗