1. Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components. Issue 1 (1st February 2021) Authors: Kwak, Jae B.; Chung, Soonwan Journal: Microelectronics international Issue: Volume 38:Issue 1(2021) Page Start: 14 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components. Issue 1 (29th January 2021) Authors: Kwak, Jae B.; Chung, Soonwan Journal: Microelectronics international Issue: Volume 38:Issue 1(2021) Page Start: 14 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Realistic warpage evaluation of printed board assembly during reflow process. Issue 4 (7th September 2015) Authors: Chung, Soonwan; Kwak, Jae B. Journal: Soldering & surface mount technology Issue: Volume 27:Issue 4(2015) Page Start: 137 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Realistic warpage evaluation of printed board assembly during reflow process. Issue 4 (7th September 2015) Authors: Chung, Soonwan; Kwak, Jae B. Journal: Soldering & surface mount technology Issue: Volume 27:Issue 4(2015) Page Start: 137 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects. Issue 1 (2nd February 2015) Authors: Kwak, Jae B.; Chung, Soonwan Journal: Soldering & surface mount technology Issue: Volume 27:Issue 1(2015) Page Start: 1 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects. Issue 1 (2nd February 2015) Authors: Kwak, Jae B.; Chung, Soonwan Journal: Soldering & surface mount technology Issue: Volume 27:Issue 1(2015) Page Start: 1 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗