1. Miniaturized and high-performance RF packages with ultra-thin glass substrates. (July 2018) Authors: Kim, Min Suk; Pulugurtha, Markondeya Raj; Kim, Youngwoo; Park, Gapyeol; Cho, Kyungjun; Smet, Vanessa; Sundaram, Venky; Kim, Joungho; Tummala, Rao Journal: Microelectronics journal Issue: Volume 77(2018) Page Start: 66 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗