1. Application of laser spot cutting on spring contact probe for semiconductor package inspection. (1st December 2017) Authors: Lee, Dongkyoung; Cho, Jungdon; Kim, Chan Ho; Lee, Seung Hwan Journal: Optics & laser technology Issue: Volume 97(2017) Page Start: 90 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗