1. Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys. (October 2016) Authors: Kim, Gyuseok; Chai, Xuzhao; Yu, Le; Cheng, Xuemei; Gianola, Daniel S. Journal: Scripta materialia Issue: Volume 123(2016) Page Start: 113 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗