1. Development, characterisation and simulation of wafer bonded Si-on-SiC substrates. (May 2018) Authors: Gammon, P.M.; Chan, C.W.; Li, F.; Gity, F.; Trajkovic, T.; Pathirana, V.; Flandre, D.; Kilchytska, V. Journal: Materials science in semiconductor processing Issue: Volume 78(2018) Page Start: 69 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗