1. Inductively coupled plasma reactive ion etching of copper thin films using ethylenediamine/butanol/Ar plasma. (November 2020) Authors: Cha, Moon Hwan; Lim, Eun Taek; Park, Sung Yong; Lee, Ji Su; Chung, Chee Won Journal: Vacuum Issue: Volume 181(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗