1. Direct Wafer Bonding of GaN for Power Devices Applications. (20th July 2018) Authors: Dragoi, Viorel; Razek, Nasser; Guiot, Eric; Caulmilone, Raphael; Liao, Michael; Wang, Yekan Steven; Goorsky, Mark S.; Yates, Luke; Graham, Samuel Journal: ECS transactions Issue: Volume 86:Number 5(2018) Page Start: 23 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗