Author/Creator: Bock, Karlheinz - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Bock, Karlheinz

1. Effect of temperature on vibration durability of lead-free solder joints. (December 2022)

Authors:: Höhne, Robert; Meier, Karsten; Dasgupta, Abhijit; Leslie, David; Ochmann, Maximilian; Bock, Karlheinz
Journal:: Microelectronics and reliability
Issue:: Volume 139(2022)
Page Start:
Record Type:: Journal Article
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2. Electronic module assembly. Issue 2 (2021)

Authors:: Franke, Jörg; Wang, Lihui; Bock, Karlheinz; Wilde, Jürgen
Journal:: CIRP annals
Issue:: Volume 70:Issue 2(2021)
Page Start:: 471
Record Type:: Journal Article
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3. Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly. (August 2018)

Authors:: Meier, Karsten; Metasch, René; Roellig, Mike; Bock, Karlheinz
Journal:: Microelectronics and reliability
Issue:: Volume 87(2018)
Page Start:: 125
Record Type:: Journal Article
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4. Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems. (May 2018)

Authors:: Nieweglowski, Krzysztof; Lorenz, Lukas; Lüngen, Sebastian; Tiedje, Tobias; Wolter, Klaus-Jürgen; Bock, Karlheinz
Journal:: Microelectronics and reliability
Issue:: Volume 84(2018)
Page Start:: 121
Record Type:: Journal Article
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5. Roll-to-roll processing of film substrates for hybrid integrated flexible electronics. (21st February 2018)

Authors:: Palavesam, Nagarajan; Marin, Sonia; Hemmetzberger, Dieter; Landesberger, Christof; Bock, Karlheinz; Kutter, Christoph
Journal:: Flexible and printed electronics
Issue:: Volume 3:Number 1(2018)
Page Start:
Record Type:: Journal Article
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6. The effect of low temperature conditions on vibration durability of SAC105 interconnects. (July 2021)

Authors:: Meier, Karsten; Ochmann, Maximilian; Leslie, David; Dasgupta, Abhijit; Bock, Karlheinz
Journal:: Microelectronics and reliability
Issue:: Volume 122(2021)
Page Start:
Record Type:: Journal Article
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7. Warpage measurements to support the development of mmWave modules. (November 2022)

Authors:: Albrecht, Oliver; Meier, Karsten; Schaulin, Michael; Toussaint, Pierre-Louis; Gamba, Baptiste; Cruz, Rodolfo; Vernhes, Pierre; Götze, Christian; Bock, Karlheinz
Journal:: Microelectronics and reliability
Issue:: Volume 138(2022)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗