Author/Creator: Bi, Wenbo - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Bi, Wenbo

41. Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing. (January 2017)

Authors:: Liu, Tengyun; Ge, Peiqi; Bi, Wenbo; Gao, Yufei
Journal:: Materials science in semiconductor processing
Issue:: Volume 57(2016)
Page Start:: 147
Record Type:: Journal Article
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42. The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon. (1st March 2019)

Authors:: Li, Xinying; Gao, Yufei; Ge, Peiqi; Zhang, Lei; Bi, Wenbo
Journal:: Materials science in semiconductor processing
Issue:: Volume 91(2019)
Page Start:: 316
Record Type:: Journal Article
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43. The interaction of periodically distributed parallel cracks in anisotropic materials subjected to concentrated loads. (August 2018)

Authors:: Wang, Peizhi; Ge, Peiqi; Bi, Wenbo; Ge, Mengran; Li, Long
Journal:: Engineering fracture mechanics
Issue:: Volume 199(2018)
Page Start:: 131
Record Type:: Journal Article
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44. The study of crack damage and fracture strength for single crystal silicon wafers sawn by fixed diamond wire. (1st November 2021)

Authors:: Liu, Tengyun; Ge, Peiqi; Bi, Wenbo; Gao, Yufei
Journal:: Materials science in semiconductor processing
Issue:: Volume 134(2021)
Page Start:
Record Type:: Journal Article
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45. Transverse forced vibration of a diamond wire under support excitations. (1st January 2023)

Authors:: Zheng, Jintao; Ge, Peiqi; Bi, Wenbo; Zhao, Yukang; Wang, Chao
Journal:: International journal of mechanical sciences
Issue:: Volume 237(2023)
Page Start:
Record Type:: Journal Article
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