Author/Creator: Bang, Junghwan - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Bang, Junghwan

1. Effective (Pd, Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad. (February 2022)

Authors:: Kim, Jungsoo; Park, Dae-Young; Ahn, Byeongjin; Bang, Junghwan; Kim, Min-Su; Park, Hyun-Soon; Sohn, Yoonchul; Ko, Yong-Ho
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
Page Start:
Record Type:: Journal Article
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2. Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate. (August 2019)

Authors:: Bang, Junghwan; Yu, Dong-Yurl; Ko, Yong-Ho; Son, Jun-Hyuk; Nishikawa, Hiroshi; Lee, Chang-Woo
Journal:: Microelectronics and reliability
Issue:: Volume 99(2019)
Page Start:: 62
Record Type:: Journal Article
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