Author/Creator: Bae, Hyun-Cheol - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Bae, Hyun-Cheol

1. Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. (April 2017)

Authors:: Yoon, Hyungseok; Choi, Kwang-Seong; Bae, Hyun-Cheol; Moon, Jong-Tae; Eom, Yong-Sung; Jeon, Insu
Journal:: Microelectronics and reliability
Issue:: Volume 71(2017)
Page Start:: 41
Record Type:: Journal Article
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2. Fabrication of Cu Wiring Touch Sensor via Laser Sintering of Cu Nano/Microparticle Paste on 3D‐Printed Substrate. Issue 1 (9th October 2020)

Authors:: Ahn, Hyeon-Sik; Oh, Ae-Sun; Kim, Dong-Hwan; Choi, Yoonseuk; Kim, Kyung-Hyun; Bae, Hyun-Cheol
Journal:: Advanced engineering materials
Issue:: Volume 23:Issue 1(2021)
Page Start:: n/a
Record Type:: Journal Article
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