1. Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling. (24th May 2021) Authors: Ait Belaid, Khaoula; Belahrach, H.; Ayad, H. Other Names: Ejbali Ridha Academic Editor. Journal: Applied computational intelligence and soft computing Issue: Volume 2021(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗