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You searched for: Author/Creator Arriola, Emmanuel R.- Arriola, Emmanuel R. [remove] 2
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- AI Artificial Intelligence -- BEOL Back-end-of-line -- BGA Ball grid array -- CTE Coefficient of thermal expansion -- DL-WLCSP Double layer wafer-level chip-scale package -- DPS-WLCSP Double-pad wafer-level chip-scale package -- FEA Finite element analysis -- IMC Intermetallic compounds -- PCB Printed circuit board -- RDL Redistribution Layer -- RF Radio Frequency -- SAC Sn-Ag-Cu solder -- UBM Under-bump metallization -- WLCSP Wafer-level chip-scale Package 1
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