Author/Creator: Arabi, F. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Arabi, F.

1. Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability. (November 2020)

Authors:: Arabi, F.; Gracia, A.; Delétage, J.-Y.; Frémont, H.
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
Page Start:
Record Type:: Journal Article
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2. Identification and analysis of power substrates degradations subjected to severe aging tests. Issue 9 (August 2015)

Authors:: Woirgard, E.; Arabi, F.; Sabbah, W.; Martineau, D.; Theolier, L.; Azzopardi, S.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1961
Record Type:: Journal Article
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3. Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices. (September 2016)

Authors:: Arabi, F.; Theolier, L.; Martineau, D.; Deletage, J.-Y.; Medina, M.; Woirgard, E.
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 409
Record Type:: Journal Article
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4. Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices. (September 2016)

Authors:: Arabi, F.; Theolier, L.; Martineau, D.; Deletage, J.-Y.; Medina, M.; Woirgard, E.
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 409
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

5. Sequential combined thermal cycling and vibration test and simulation of printed circuit board. (September 2018)

Authors:: Arabi, F.; Gracia, A.; Delétage, J.-Y.; Frémont, H.
Journal:: Microelectronics and reliability
Issue:: Volume 88/90(2018)
Page Start:: 768
Record Type:: Journal Article
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6. Thermo-mechanical assessment of silver sintering for attaching power components in embedded PCB. (November 2020)

Authors:: Arabi, F.; Youssef, T.; Coudert, M.; Coquery, G.; Alayli, N.; Martineau, D.; Belnoue, O.
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗