1. Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies. (1st September 2013) Authors: Rathinavelu, U; Jellesen, M S; Ambat, R Journal: Corrosion engineering, science, and technology Issue: Volume 48:Number 6(2013) Page Start: 436 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies. (1st September 2013) Authors: Rathinavelu, U; Jellesen, M S; Ambat, R Journal: Corrosion engineering, science, and technology Issue: Volume 48:Number 6(2013) Page Start: 436 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components. (1st September 2013) Authors: Verdingovas, V; Jellesen, M S; Ambat, R Journal: Corrosion engineering, science, and technology Issue: Volume 48:Number 6(2013) Page Start: 426 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components. (1st September 2013) Authors: Verdingovas, V; Jellesen, M S; Ambat, R Journal: Corrosion engineering, science, and technology Issue: Volume 48:Number 6(2013) Page Start: 426 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Novel electrochemical approach to study corrosion mechanism of Al-Au wire-bond pad interconnections. (1st September 2013) Authors: Elisseeva, O V; Bruhn, A; Cerezo, J; Mavinkurve, A; Rongen, R T H; O'Halloran, G M; Ambat, R; Terryn, H; Mol, J M C Journal: Corrosion engineering, science, and technology Issue: Volume 48:Number 6(2013) Page Start: 409 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Novel electrochemical approach to study corrosion mechanism of Al-Au wire-bond pad interconnections. (1st September 2013) Authors: Elisseeva, O V; Bruhn, A; Cerezo, J; Mavinkurve, A; Rongen, R T H; O'Halloran, G M; Ambat, R; Terryn, H; Mol, J M C Journal: Corrosion engineering, science, and technology Issue: Volume 48:Number 6(2013) Page Start: 409 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗