1. Computational analysis and experimental evidence of two typical levelers for acid copper electroplating. (20th May 2018) Authors: Lai, Zhiqiang; Wang, Shouxu; Wang, Chong; Hong, Yan; Chen, Yuanming; Zhang, Huaiwu; Zhou, Guoyun; He, Wei; Ai, Kehua; Peng, Yongqiang Journal: Electrochimica acta Issue: Volume 273(2018) Page Start: 318 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Enhanced manganese leaching from electrolytic manganese residue by electrochemical process and Na2SO3. (November 2022) Authors: Zhao, Zhisheng; Wang, Rui; Shu, Jiancheng; Chen, Mengjun; Xu, Zhonghui; Xue, Tao; Zeng, Xiangfei; He, Dejun; Tan, Daoyong; Deng, Zongyu; Ai, Kehua Journal: Minerals engineering Issue: Volume 189(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Enhancing inductance of spiral copper inductor with BaFe12O19/poly (phenylene oxide) composite as an embedded magnetic core. (1st April 2018) Authors: He, Xuemei; Chen, Yuanming; Wang, Shouxu; He, Wei; Wang, Chong; Zhang, Huaiwu; Li, Qinghua; Ai, Kehua Journal: Composites Issue: Number 138(2018) Page Start: 232 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Mechanism analysis of microvia filling based on multiphysics coupling. Issue 2 (15th January 2018) Authors: Ji, Linxian; Su, Shidong; Nie, Hexian; Wang, Shouxu; He, Wei; Ai, Kehua; Li, Qinghua Journal: Circuit world Issue: Volume 44:Issue 2(2018) Page Start: 60 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Mechanism analysis of microvia filling based on multiphysics coupling. Issue 2 (8th May 2018) Authors: Ji, Linxian; Su, Shidong; Nie, Hexian; Wang, Shouxu; He, Wei; Ai, Kehua; Li, Qinghua Journal: Circuit world Issue: Volume 44:Issue 2(2018) Page Start: 60 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Study of microvia filling process based on multi-physical coupling. (4th March 2018) Authors: Ji, Linxian; Nie, Hexian; Su, Shidong; Chen, Yuanming; He, Wei; Ai, Kehua Journal: Transactions of the Institute of Metal Finishing Issue: Volume 96:Number 2(2018) Page Start: 86 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution. Issue 14 (1st January 2017) Authors: Tao, Zhihua.; He, Wei.; Li, Jing; Wang, Shouxu; Chen, Yuanming; Ai, Kehua; Peng, Yongqiang; Hong, Yan Journal: Journal of the Electrochemical Society Issue: Volume 164:Issue 14(2017) Page Start: D1034 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution. Issue 14 (28th December 2017) Authors: Tao, Zhihua.; He, Wei.; Li, Jing; Wang, Shouxu; Chen, Yuanming; Ai, Kehua; Peng, Yongqiang; Hong, Yan Journal: Journal of the Electrochemical Society Issue: Volume 164:Issue 14(2017) Page Start: D1034 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗