1. A computational fluid dynamics analysis of the wave soldering process. Issue 5 (1st June 2015) Authors: Abdul Aziz, M.S.; Abdullah, M.Z.; Khor, C.Y.; Mazlan, M.; Iqbal, A.M.; Fairuz, Z.M. Journal: International journal of numerical methods for heat & fluid flow Issue: Volume 25:Issue 5(2015) Page Start: 1231 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. A computational fluid dynamics analysis of the wave soldering process: Influence of propeller blades on fountain flow. Issue 5 (1st June 2015) Authors: Abdul Aziz, M.S.; Abdullah, M.Z.; Khor, C.Y.; Mazlan, M.; Iqbal, A.M.; Fairuz, Z.M. Journal: International journal of numerical methods for heat & fluid flow Issue: Volume 25:Issue 5(2015) Page Start: 1231 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Analysis of LED wire bonding during encapsulation process. Issue 1 (December 2020) Authors: Roslan, Hafiz; Abdul Aziz, M.S.; Abdullah, M.Z.; Kamarudin, R.; Ishak, M.H.H.; Ismail, F.; Purna Irawan, Agustinus Journal: IOP conference series Issue: Volume 1007:Issue 1(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board. (May 2017) Authors: Lim, C.H.; Abdullah, M.Z.; Azid, I.A.; Abdul Aziz, M.S. Journal: Microelectronics and reliability Issue: Volume 72(2017) Page Start: 5 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Experimental study on luminous intensity of white LEDs of different configurations. Issue 1 (December 2020) Authors: Abdul Alim, Md; Abdullah, M. Z.; Abdul Aziz, M.S.; Kamarudin, R.; Purna Irawan, Agustinus; Siahaan, E. Journal: IOP conference series Issue: Volume 1007:Issue 1(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects. Issue 2 (16th July 2020) Authors: Lim, Chong Hooi; Abdullah, M.Z.; Abdul Azid, I.; Khor, C.Y.; Abdul Aziz, M.S.; Ishaik, M.H.H. Journal: Circuit world Issue: Volume 47:Issue 2(2021) Page Start: 213 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Influence of squeegee impact on stencil printing process: CFD approach. Issue 1 (October 2020) Authors: Ishak, M.H.H.; Abdul Aziz, M.S.; Abdul Samad, M.H.S.; Ismail, Farzad; Mohd Salleh, M.A.A Journal: IOP conference series Issue: Volume 957:Issue 1(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Thermal fluid-structure interaction of PCB configurations during the wave soldering process. Issue 1 (2nd February 2015) Authors: Abdul Aziz, M.S.; Abdullah, M.Z.; Khor, C.Y. Journal: Soldering & surface mount technology Issue: Volume 27:Issue 1(2015) Page Start: 31 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Thermal fluid-structure interaction of PCB configurations during the wave soldering process. Issue 1 (2nd February 2015) Authors: Abdul Aziz, M.S.; Abdullah, M.Z.; Khor, C.Y. Journal: Soldering & surface mount technology Issue: Volume 27:Issue 1(2015) Page Start: 31 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗